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Global and China Mobile Phone RF (Radio Frequency) Industry Report, 2008-2009

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Global and China Mobile Phone RF (Radio Frequency) Industry Report, 2008-2009

  • 【報告編號】: 33335
  • 【最新修訂】: 2009年03月25日
  • 【關 鍵 字】: Global and China Mobile Phone RF (Radio Frequency) Industry Report 2008-2009
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報告目錄

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Global and China Mobile Phone RF (Radio Frequency) Industry Report, 2008-2009

1. Global Mobile Phone Market Developments
1.1 Market Overview
1.2 Market Developments
1.2.1 The Mobile Phone Internet 
1.2.2 Extensively Application of HSPA

2. China’s Mobile Phone Market Developments 
2.1 Market Overview
2.2 Mobile Phone Export 
2.3 Smart Mobile Phone Market 

3. Introduction of RF Semiconductors
3.1 RF Circuit Structure 
3.2 Techniques 

4. Global Mobile Phone RF Market Developments 
4.1 Global Market Scale 
4.2 Global Frequency Allocation Forecast 
4.3 Global Market Share Distribution of Global Handset RF Vendors 
4.4 RF in 4G 
4.5 Receiver in 4G 
4.6 PA in 3G and 4G 
4.7 WLAN Mobile Phone

5. Mobile Phone vendors 
5.1 Nokia 
5.2 Motorola
5.3 Samsung 
5.4 Sony Ericsson 
5.5 LG
5.6 Platform Research of Chinese Mobile Phone Vendors
5.6.1 K-Touch 
5.6.2 Lenovo 
5.6.3 Gionee 
5.7 RF Configuration of Smart Phones  
5.7.1 BlackBerry BOLD
5.7.2 BlackBerry STORM
5.7.3 HTC TOUCH
5.7.4 Sony Ericsson XPERIA X1
5.7.5 T-MOBILE T1
5.7.6 MOTO KRAVE ZN4
5.7.7 Nokia N95
5.7.8 APPLE IPHONE 16GB

6. Global Mobile Phone RF Semiconductor Vendors 
6.1 SKYWORKS
6.2 ST-Ericsson 
6.3 INFINEON
6.4 Silicon Lab
6.5 RFMD
6.6 Freescale
6.7AVAGO
6.8 QUALCOMM
6.9 ANADIGICS
6.10 TRIQUINT
6.11 MAXIM
6.12 Sirific Wireless
6.13 Sequoia Communications
6.14 Tropian
6.15 RENESAS
6.16 SiGe Semiconductor
6.17 Airoha Technology Corp.
6.18 Beijing LHWT Microelectronics Inc.
6.19 Epic Communications, Inc. (Epicom)
6.20 Yuantonix, Inc.
6.21 Comlent Technology, Inc. (Comlent)
6.22 Rising Micro-Electronics Co., Ltd. (RME)
6.23 RDA Microelectronics


Global Mobile Phone Shipment and Overall Proportion of Smart Phones, 2007-2012e
Global Quarterly Mobile Phone Shipment and Its Growth, 2007-2008
Regional Distribution of Global Mobile Phone Shipment , 2007-2008
Global Market Share Distribution of Major Mobile Phone Vendors, 2008
Global Market Share Distribution of Major Smart Phone Vendors, 1Q 2007-3 Q 2008
Global Market Share Distribution of Major Smart Phone Vendors, 2008
Mobile Phone Development Trend
Mobile Phone Development Forecast, 1995-2012e
Developments of Mobile Phone Communication Protocol Stack, 2008-2013e
UMTS-HSPA Network Distribution in Latin America 
Mobile Phone Sales in China and overall Proportion of Smart Phones, 2004-2012e
Mobile Phone Output in China, 2004-2012e
China’s Mobile Phone Export Volume, 1999-2008
China’s Mobile Phone Export Destinations, 2002-2008
Market Share Distribution of Major Smart Phone Vendors in China, 2008
RF Framework of Typical Wireless Terminal Equipments 
RF Components of Typical Wireless Telecom Terminal Equipments
Framework of Super-heterodyne
Framework of Homodyne
Framework and Typical Application Diagram of Harley
Framework of Weaver
Global Mobile Phone RF Market Scale, 2003-2010e
Global Mobile Phone Frequency Distributions, 2009-2013e
Global Market Share Distribution of Major Mobile Phone RF Receiver Vendors by Shipment, 2008
Global Market Share Distribution of Major Mobile Phone PA Vendors, 2008
Global Market Share Distribution of Major GSM PA Vendors, 2008
Global Market Share Distribution of Major CDMA PA Vendors, 2008
Global Market Share Distribution of Major WCDMA PA Vendors, 2008
Global 4G Frequency Distributions 
Developments of Mobile Phone Power Amplifier, 2007-2022e
Technical Capability of Major PA Vendors in the World 
Inner Framework of SKY77441
Mobile Broadband User Qty., 2005-2012e
Inner Framework of STLC4560
Framework of WiLINK4.0
Inner Framework of RF5924
Quarterly Mobile Phone Shipment of Nokia in China, 2005Q3-2008Q4
Quarterly Mobile Phone Shipment of Samsung, 2005Q1-2008Q4
Quarterly Shipment and Average Selling Price of Sony Ericsson, 2005Q1-2008Q4
Quarterly Shipment of LG, 2005Q4-2008Q4
Organizational Structure of K-Touch
Organizational Structure of Gionee
Organizational Structure of JinMing Electronics 
Sales Revenue and Gross Profit Margin of SKYWORKS, 2002-2008 
Sales Revenues of SKYWORKS from Its Core Products, 2003-2008
Regional Sales Revenues of SKYWORKS, 2005-2008
Clients of SKYWORKS, 2007-2008
Revenue Structure of ST, 2008
Sales Revenue of ST, 2005-2008
Regional Sales Revenue of ST, 2008
Organizational Structure of ST
Revenue of ST from Its Wireless Division, 2003-2008
Quarterly Revenue of Infineon from Its Communication Division, 2006Q4-2008Q4
Transceiver Shipment of Infineon, 2003-2007
RF Chip Road Map of Infineon
Inner Framework of PMB6952
Sale Revenue and Gross Profit Margin of Silicon Lab, 2001-2005
Sales Revenue and Gross Profit Margin of RFMD, 2001-2008
Freescale’s Revenue Structure, 2006-2008
Sales Revenue and Gross Profit Margin of Avago , 2004-2008
Avago’s Revenue Structure, 2006-2008
Wireless Products of Avago
RF Products of Avago 
Inner Framework of WS1102
Inner Framework of ACPM-7881
Quarterly MSM Chip Shipment of Qualcomm, 2004-2008
Regional RF Chip Distribution of Qualcomm 
Revenue and Gross Profit Margin of ANADIGICS, 2003-2008
Main Clients of ANADIGICS
Revenue and Gross Profit Margin of TRIQUINT, 2001-2008
Inner Framework of SW2210
Inner Framework of SW3200
Inner Framework of SW3210
Inner Framework of PF08155B
Inner Framework of RPF09025B
Inner Framework of R2A60273
Application of TRIQUINT’s Products, 2005-2008
Network Standard of TRIQUINT’s Mobile Phones, 2005-2008
Market Share Distribution of GaAs Wafer OEMs in 2007
Core Competence of TRIQUINT’s Mobile Phone Business
Block Diagram of MAXIM TD-SCDMA RF System 
Block Diagram of MAXIM CDMA2000 Dual-band RF Solution
Block Diagram of MAXIM CDMA2000 Single-band RF Solution
Block Diagram of MAXIM WCDMA RF Solution 
Airoha’s RF Products Development Roadmap
Airoha WLAN RF Chip Products Development Roadmap
Mobile Phone Shipment of Global Top13 Vendors in 2008
Ranking of China Top 25 Mobile Phone Vendors by Output in 2008
China’s Top 23 Mobile Phone Export Destinations in 2008
Six Typical Models of PA in 3G 
Comparison between HSPA and Mobile WiMAX
Configuration List of Nokia’s 30 Typical Mobile Phone Models
Configuration List of Motorola’s 3 Mobile Phones Models
Configuration List of Samsung’s 20 Typical Mobile Phones Models
Sony Ericsson Mobile Platform
Configuration List of LG’s 17 Typical Mobile Phones Models
Configuration List of K-Touch’s 11 Typical Mobile Phones Models
Configuration List of Lenovo’s 10 Typical Mobile Phone Models
Configuration List of Gionee’s 5 Typical Mobile Phones Models
Configuration of Blackberry STORM 
HTC Touch ProBill of Materials 
Configuration of Sony Ericsson XPERIA X1 
Configuration of MOTO KRAVE ZN4
Configuration of T-MOBILE T1
Configuration f N95
Configuration of APPLE IPHONE 16GB 
Four Production Bases of SKYWORKS
GSM/GPRS/EDGE Power Amplifier Product List of SKYWORKS 
Receiver Product List of Infineon 
Receiver Product List of Silicon Lab 
RFMD’s Quarterly Revenue and Gross Profit, 1Q2007-4Q2008
Quarterly Revenue of Freescale’s Mobile Phone Department, 1Q2006-4Q2008
RF Product List of Freescale 
RF PA Product List of AVAGO 
Airoha’s Main Products
Main Products of LHWT Microelectronics 
Main Products of Epic Communications
Wireless PA Product List of TALENT  

報告描述

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Mobile phone RF system consists mainly of transceivers, power amplifier (abbreviated as PA thereafter) and antenna switch. PA might be set in the Front-End-Module or FEM. In 2G, the cost of RF system was only about US $1.5, while In 3G, the cost was increased to between US$6.0 and US$8.0, and the cost will further increased to about US$8.0 to US$10.0 in 4G, obviously, FR system had the highest cost growth during the upgrading of mobile phones.

The receiver is a part of the mobile phone platform. Generally the mobile phone baseband vendors also provide the receivers, however, Nokia’s baseband was from Texas Instruments, but its receiver was from ST Microelectronics or Infineon. ST Microelectronics has further enhanced its baseband ability through the consolidation between NXP and Ericsson mobile platform.

PA (Power Amplifier) is the most key component in a mobile phone, which decides the voice quality, connection time, standby time and signal strength. PA has been produced by compound semiconductor manufacturers all along, including RFMD, Skyworks, Triquint, Anadigics, Avago and Renesas. Renesas still relies on the previous products form Hitachi Semiconductor, launched none of any new products.

RFMD has always been the NO.1, but the gap between RFMD and Skyworks is shrinking gradually. RFMD relies much on Nokia and Motorola. 75% sales of RFMD are contributed by those two. On the other hand, above 90% PA of Nokia is from RFMD. Skyworks’s main clients are Sony Ericsson, Motorola, LG and Samsung. The world’s first 4G FEM containing PA was from Skyworks.

As the world’s largest GaAs OEM, Triquint is good at high-integration PA, as well as the PA packaging. The GSM PA with the smallest footprint and the world’s first FC packaged PA were both produced by Triquint. The main clients of Triquint are Samsung, LG, RIM and Apple.

Anadigics has a close relationship with Qualcomm, which is focused on the PA development for CDMA and WCDMA. Especially it has a high market share in CDMA market. Since its establishment, Anadigics has been expanding continuously, but during the past five years, only one year is profitable.

Avago was previously the semiconductor department (Agilent) of HP. Avago was the first one engaged in the WCDMA development. Though its sales did not look good initially, with the increasing popularity of WCDMA, the sales turned to increase rapidly.

In 3G era, RF system becomes more complex. Some smart mobile phones have as many as five PAs, one is for all GSM frequency bands, one is for WLAN and the other three are for three 3G frequency band separately. Considering the high integration is the further development focus for PA, Skyworks and Triqunit have the biggest potential. 4G has much higher requirements to PA such as higher T/PR and higher efficiency. No matter in 2G or 3G, PA sector is always monopolized by compound semiconductor manufacturers; the traditional silicon semiconductors have no chances. PA was usually GaAs HBT in 2G , in 3G, new entrants tend to InGaP HBT, Skyworks had already acquired the PA department of Freescale. In 2009, Skyworks launched the world’s first model FEM (SKY77445) focus on LTE/EUTRAN. Anadigics also has two models of PA for LTE/EUTRAN, both of them adopted InGaP.

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